Tuesday, September 7, 2010

Through Hole Plating of PCBs Using Ultrasonically-Dispersed Copper Nanoparticles - PCB007 (press release)

http://www.terranlink.co.uk/authors/author-830.html


Through Hole Plating of PCBs Using Ultrasonically-Dispersed Copper Nanoparticles

PCB007 (press release)


Ultrasonically dispersed copper nanoparticles achieved some limited success as a conductive layer for "direct" electroplating with some penetration of the ...



No comments:

Post a Comment