Through Hole Plating of PCBs Using Ultrasonically-Dispersed Copper Nanoparticles PCB007 (press release) Ultrasonically dispersed copper nanoparticles achieved some limited success as a conductive layer for "direct" electroplating with some penetration of the ... |
Tuesday, September 7, 2010
Through Hole Plating of PCBs Using Ultrasonically-Dispersed Copper Nanoparticles - PCB007 (press release)
http://www.terranlink.co.uk/authors/author-830.html
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